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Heres the Samsung Galaxy S 4G PCB board which shows the components and ICs mounted or used in the circuit. The major ICs used were labeled as a reference and familiarization of the entire PCB board layout.

Samsung Galaxy S 4G front PCB Motherboard IC Components:

  Maxim MAX8987 DC Power Management
  Samsung KB100L00WM-A453 4Gb (512 MB) of mobile DRAM which contains a 1 GHz Intrinsity Processor in a package-on-package configuration, according to the fine folks at
  ST Ericssons THOR M5730 HSPA+ Thin Modem
  ST Ericsson GNS7560 Single Chip GPS Solution
  Bosch Sensortec Accelerometer

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Samsung Galaxy S 4G Back PCB Motherboard IC Components:

  Broadcom BCM4329 802.11n Wi-Fi, Bluetooth 2.1, and FM Tuner
  ST Ericsson RF5000 Radio Transceiver (part of THOR M570 chipset)
  Wolfson Microelectronics WM8994 Audio CODEC
  Skyworks SKY77447 Load Insensitive Power Amplifier for WCDMA / HSDPA / HSUPA / HSPA+ Band II
  Skyworks SKY77544 TX-RX Front End Module
  Skyworks SKY77460 WCDMA/HSPA+ Power Amplifier

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The Samsung Galaxy S 4G compact front and rear  camera assembly flex board.

It uses a NEC MC10170 Image Processor cleverly mounted right to its ribbon cable.


The Samsung Galaxy S 4G headphone jack, earpiece speaker, and proximity/ambient light sensors Flex cable.

Back of the display assembly mounted the Atmel mXT 224 touchscreen controller.

The removed button capacitive touch sensors, vibrator unit, lower microphone, and antenna cable connector mounted on the same flex assembly.

There you have it the labeled Samsung Galaxy S 4G PCB Board, Thats all folks!